The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Jan. 01, 2015
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Yasunobu Matsuoka, Hachioji, JP;

Toshiki Sugawara, Kokubunji, JP;

Tatemi Ido, Hachioji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 31/18 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 31/0232 (2014.01); H01L 31/167 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1808 (2013.01); G02B 6/42 (2013.01); G02B 6/4259 (2013.01); G02B 6/43 (2013.01); H01L 31/02325 (2013.01); H01L 31/167 (2013.01); G02B 6/12002 (2013.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); G02B 6/4279 (2013.01); G02B 2006/12142 (2013.01); H01L 25/167 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01);
Abstract

There are provided an optical interconnection module and an optical-electrical hybrid board using the same to process optical and electric signals on a board at a low transmission loss at high speed in transmitting high-speed optical signals sent and received between chips or between boards in a data processing apparatus. An optical interconnection module has a structure in which an optical signal is emitted from a laser optical source device, propagates the inside of a modulator device, and is deflected by a beam turning structure in the vertical direction of a substrate, an optical signal is incident from the outside of a semiconductor substrate, and transmitted and received at a photo diode provided on the semiconductor substrate, and the optical signals are optically connected to each other through the inside of the semiconductor substrate in the vertical direction of the substrate with the outside of the semiconductor substrate.


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