The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 10, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Miki Hidaka, Kanagawa-ken, JP;

Osamu Takata, Kanagawa-ken, JP;

Masahito Nishigoori, Tokyo, JP;

Yukiko Takiba, Fukuoka-ken, JP;

Hiroshi Suzunaga, Fukuoka-ken, JP;

Hiroshi Shimomura, Oita-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/167 (2006.01); H01L 31/0216 (2014.01); H01L 31/14 (2006.01); H01L 31/02 (2006.01); H01L 31/103 (2006.01); H01L 31/16 (2006.01); H01L 27/144 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 31/167 (2013.01); H01L 23/552 (2013.01); H01L 25/167 (2013.01); H01L 27/1446 (2013.01); H01L 31/02005 (2013.01); H01L 31/02016 (2013.01); H01L 31/02162 (2013.01); H01L 31/103 (2013.01); H01L 31/14 (2013.01); H01L 31/165 (2013.01);
Abstract

A light receiving element includes: a semiconductor layer; an insulating layer; an interconnect layer; and a film. The semiconductor layer includes a light receiving unit configured to convert a signal light incident on the light receiving unit into an electrical signal. The insulating layer is provided on the semiconductor layer. The interconnect layer is provided on the insulating layer. The film is provided on the insulating layer to cover the light receiving unit and be connected to the interconnect layer, the film being made of a metal or a metal nitride.


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