The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Sep. 11, 2014
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Toshio Denta, Matsumoto, JP;

Tomonori Seki, Azumino, JP;

Tadanori Yamada, Matsumoto, JP;

Tadahiko Sato, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 23/50 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/495 (2013.01); H01L 23/49517 (2013.01); H01L 23/49575 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/49 (2013.01); H01L 25/162 (2013.01); H01L 23/49861 (2013.01); H01L 23/50 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49107 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device includes a plurality of semiconductor elements; first semiconductor chips including first semiconductor elements, the first semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements and having a current flowing greater than that of the other semiconductor elements; second semiconductor chips having second semiconductor elements, the second semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements for controlling the first semiconductor elements; an insulating substrate having a first wiring pattern bonded with the first semiconductor chips; and an insulating member having a second wiring pattern mounted with the second semiconductor chips.


Find Patent Forward Citations

Loading…