The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Feb. 06, 2015
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;
Inventors:
Assignee:
TOYODA GOSEI CO., LTD., Kiyosu-shi, Aichi-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 29/866 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 33/46 (2010.01); H01L 25/075 (2006.01); H05B 33/08 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/165 (2013.01); H01L 29/866 (2013.01); H01L 33/46 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H05B 33/0803 (2013.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H05B 33/089 (2013.01);
Abstract
A light emitting device includes a substrate, a light-emitting diode chip mounted on the substrate, a Zener diode chip mounted next to the light-emitting diode chip on the substrate, a frame-like dam material formed on the substrate to surround the light-emitting diode chip and the Zener diode chip, and a light-reflective resin injected inside the dam material to coat side surfaces of the light-emitting diode chip and side surfaces and an upper surface of the Zener diode chip. A part of the frame-like dam material swells outward to surround three of the side surfaces of the Zener diode chip.