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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9379085 B1

PDFFull Text
Date of Patent:
Jun. 28, 2016

Filed:

Feb. 01, 2011

Wire bonding structure of semiconductor device and wire bonding method

Applicants:

Ryuji Tsubaki, Kyoto, JP;

Yasufumi Matsuoka, Kyoto, JP;

Inventors:

Ryuji Tsubaki, Kyoto, JP;

Yasufumi Matsuoka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/60 (2006.01); B23K 37/04 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 20/005 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/78313 (2013.01); H01L 2224/78314 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12032 (2013.01);
Abstract

A wire bonding structure is provided which includes a wire having a first bonding portion and a second bonding portion. The first bonding portion is bonded to an electrode pad of a semiconductor element, whereas the second bonding portion is bonded to a pad portion of a lead. The first bonding portion includes a front bond portion, a rear bond portion, and an intermediate portion sandwiched between these two bond portions. The front bond portion and the rear bond portion are bonded to the electrode pad more strongly than the intermediate portion is. In the longitudinal direction of the wire, the second bonding portion is smaller than the first bonding portion in bonding length.

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