The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Aug. 08, 2014
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Yuji Iizuka, Matsumoto, JP;

Masafumi Horio, Matsumoto, JP;

Hideyo Nakamura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H02M 7/00 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 29/66 (2006.01); H01L 23/498 (2006.01); H01L 23/051 (2006.01); H01L 25/11 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 23/051 (2013.01); H01L 23/3107 (2013.01); H01L 23/34 (2013.01); H01L 23/49811 (2013.01); H01L 24/02 (2013.01); H01L 25/072 (2013.01); H01L 25/117 (2013.01); H01L 25/18 (2013.01); H01L 29/66325 (2013.01); H02M 7/003 (2013.01); H05K 1/0263 (2013.01); H01L 23/5385 (2013.01); H01L 2224/06 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.


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