The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 13, 2015
Applicant:

Hgst Technologies Santa Ana, Inc., Santa Ana, CA (US);

Inventor:

Tsan Lin Chen, Zhubei, TW;

Assignee:

HGST Technologies Santa Ana, Inc., Santa Ana, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 23/00 (2006.01); G06F 12/02 (2006.01); H01L 27/02 (2006.01); G06F 13/16 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); G06F 12/0246 (2013.01); G06F 13/16 (2013.01); H01L 24/06 (2013.01); H01L 27/0292 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/0914 (2013.01); H01L 2224/09515 (2013.01);
Abstract

Some embodiments of the disclosed subject matter include an integrated circuit. The integrated circuit includes a solid state device controller configured to control a plurality of flash memory devices, a first set of input output IO pads, coupled to the solid state device controller, arranged as a first pad ring around a perimeter of the integrated circuit, and a second set of IO pads arranged adjacent to at least one side of the first pad ring, wherein one of the second set of IO pads includes a power source node configured to receive a power supply voltage for the solid state device controller, a ground node, and a bond pad configured to receive an external signal.


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