The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Apr. 17, 2014
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/0612 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01);
Abstract
Embodiments of a packaged semiconductor device with no leads are disclosed. One embodiment includes a semiconductor chip and a no leads package structure defining a boundary and having a bottom surface and includes three or more pads exposed at the bottom surface of the package structure. Each of the pads is located in a single inline row.