The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Jul. 14, 2014
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
Provided is a semiconductor package including a plurality of first semiconductor chips that are stacked on a substrate and a second semiconductor chip disposed on the plurality of first semiconductor chips. The plurality of first semiconductor chips comprises a first semiconductor chip group and a second semiconductor chip group. The first semiconductor chip group is electrically connected to the second semiconductor chip through a first channel. The second semiconductor chip group is electrically connected to the second semiconductor chip through a second channel. At least one of the first channel and the second channel extends along a top surface of the first semiconductor chip which is disposed on the uppermost side, or top of the stack, among the plurality of first semiconductor chips. The inventive concept may provide the semiconductor package having a high operation speed, low power consumption, and a small thickness and capable of being manufactured at low costs.