The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Nov. 01, 2012
Applicant:
Schlumberger Technology Corporation, Sugar Land, TX (US);
Inventors:
Francois Barbara, Sartrouville, FR;
Lahcen Garando, Orsay, FR;
Assignee:
SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 4/04 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); E21B 4/04 (2013.01); H01L 23/15 (2013.01); H01L 24/45 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48744 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/01327 (2013.01);
Abstract
An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.