The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Sep. 04, 2013
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Mandy Hin Lam, Fremont, CA (US);

Hong Tran Huynh, Fremont, CA (US);

M. Baris Dogruoz, Sunnyvale, CA (US);

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/4006 (2013.01); H01L 2023/405 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.


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