The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Apr. 28, 2011
Shogo Mori, Kariya, JP;
Yoshitaka Iwata, Kariya, JP;
Satoshi Watanabe, Kariya, JP;
Kenji Tsubokawa, Satsumasendai, JP;
Toshio Kawaguchi, Satsumasendai, JP;
Shogo Mori, Kariya, JP;
Yoshitaka Iwata, Kariya, JP;
Satoshi Watanabe, Kariya, JP;
Kenji Tsubokawa, Satsumasendai, JP;
Toshio Kawaguchi, Satsumasendai, JP;
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-Ken, JP;
KYOCERA CORPORATION, Kyoto, JP;
Abstract
Disclosed is a heat dissipation device which is reduced in the number of components, while having sufficient insulating function and cooling function with respect to an object to be cooled. The heat dissipation device includes a base that is formed from a ceramic and a refrigerant channel for circulating a refrigerant within the base. The base is formed by sintering a stacked body in which a plurality of ceramic sheets are stacked. The plurality of ceramic sheets include the ceramic sheet which is provided with a plurality of slits that constitute the refrigerant channel, and the ceramic sheets which are provided with communication paths that communicate the refrigerant channel and outside units with each other. A semiconductor device is configured by bonding a metal plate, on which a semiconductor element is mounted, to the heat dissipation device.