The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 14, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Brett W. Degner, Menlo Park, CA (US);

Gavin J. Reid, Campbell, CA (US);

Brandon S. Smith, Mountain View, CA (US);

Raymond S. Shan, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/20336 (2013.01);
Abstract

This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.


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