The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Mar. 18, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Ralf Wombacher, Maxhuette-Haidhof, DE;
Horst Theuss, Wenzenbach, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/055 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/291 (2013.01); B81B 7/0025 (2013.01); H01L 23/055 (2013.01); H01L 23/298 (2013.01); H01L 23/564 (2013.01); H01L 24/34 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48669 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48769 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48869 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/81951 (2013.01); H01L 2224/83 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19043 (2013.01);
Abstract
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.