The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Mar. 12, 2014
Applicant:

Wafertech, Llc, Camas, WA (US);

Inventors:

Cuker Huang, Vancouver, WA (US);

Yihguei Wey, Camas, WA (US);

Assignee:

WAFERTECH, LLC, Camas, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/3065 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/28 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0273 (2013.01); H01L 21/0338 (2013.01); H01L 21/28123 (2013.01); H01L 21/3065 (2013.01); H01L 21/3088 (2013.01); H01L 21/31138 (2013.01); H01L 21/32137 (2013.01); H01L 21/32139 (2013.01); H01L 22/12 (2013.01);
Abstract

Methods for forming a semiconductor devices are provided. A plasma pre-treatment operation is performed on a photoresist pattern formed over a material disposed over a substrate, and reduces critical dimensions (CDs) of features of the photoresist pattern to a greater extent at a central portion of the substrate than at outer portions of the substrate, thereby forming a treated pattern with a gradient of CDs. The material is then etched using the treated pattern as a photomask. An overetch operation that tends to reduce CDs of the etched features of the material to a greater extent at outer portions of the substrate than at the central portion of the substrate, is employed. The plasma pre-treatment operation is designed in conjunction with the overetch characteristics and, in combination, the operations produce etched features having CDs with a high degree of uniformity across the substrate.


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