The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

May. 21, 2012
Applicants:

Toshifumi Taira, Osaka, JP;

Masashi Mehata, Osaka, JP;

Inventors:

Toshifumi Taira, Osaka, JP;

Masashi Mehata, Osaka, JP;

Assignee:

TOYO ALUMINIUM KABUSHIKI KAISHA, Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/052 (2006.01); C22C 21/02 (2006.01); B32B 15/01 (2006.01); C22C 21/00 (2006.01); H01G 9/045 (2006.01); H01G 9/055 (2006.01); B22F 1/00 (2006.01); B22F 7/04 (2006.01); B22F 7/08 (2006.01); C22C 1/04 (2006.01); B22F 3/22 (2006.01); C22F 1/04 (2006.01); C22F 1/043 (2006.01); C23C 24/02 (2006.01);
U.S. Cl.
CPC ...
H01G 9/052 (2013.01); B22F 1/0003 (2013.01); B22F 3/22 (2013.01); B22F 7/04 (2013.01); B22F 7/08 (2013.01); B32B 15/01 (2013.01); B32B 15/016 (2013.01); C22C 1/0416 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22F 1/04 (2013.01); C22F 1/043 (2013.01); C23C 24/02 (2013.01); H01G 9/045 (2013.01); H01G 9/055 (2013.01); B22F 2301/052 (2013.01); B22F 2998/10 (2013.01);
Abstract

The present invention provides an electrode material for an aluminum electrolytic capacitor, which does not require any etching treatment and which has improved bending strength. Specifically, the present invention provides an electrode material for an aluminum electrolytic capacitor, which comprises, as constituent elements, a sintered body of a powder of at least one member selected from the group consisting of aluminum and aluminum alloys and an aluminum foil substrate that supports the sintered body thereon, which is characterized in that (1) the powder has an average particle size Dof 0.5 to 100 μm, (2) the sintered body is formed on one surface or both surfaces of the aluminum foil substrate and has a total thickness of 20 to 1,000 μm, and (3) the aluminum foil substrate has a thickness of 10 to 200 μm and an Si content of 10 to 3,000 ppm.


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