The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Mar. 07, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 41/00 (2006.01); H01F 27/24 (2006.01); H01F 27/00 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/00 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/00 (2013.01); H01F 27/24 (2013.01); H01F 41/005 (2013.01); H01F 41/046 (2013.01); H01F 2027/2809 (2013.01); Y10T 29/4902 (2015.01);
Abstract
There are provided a multilayer electronic component and a method of manufacturing the same. More particularly, there are provided a multilayer electronic component capable of maintaining high inductance at a high frequency due to excellent magnetic properties and having excellent DC bias properties and a dense fine structure to thereby improve strength, and a method of manufacturing the same.