The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Nov. 15, 2011
Applicants:
Yoshinori Nagasu, Tokyo, JP;
Masaru Higuchi, Tokyo, JP;
Hisaki Sakamoto, Tokyo, JP;
Inventors:
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/06 (2006.01); H01L 39/24 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 12/06 (2013.01); H01B 13/00 (2013.01); H01L 39/2454 (2013.01);
Abstract
A superconductive wire material substrate which is formed such that a surface roughness Ra of one surface is 10 nm or less, and a surface roughness Ra of an other surface is larger than the surface roughness Ra of the one surface, and is 8 nm or more and less than 15 nm, between the surface roughnesses Ra of both surfaces of the superconductive wire material substrate.