The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Jun. 08, 2015
Applicant:

Aleris Rolled Products Germany Gmbh, Koblenz, DE;

Inventors:

Adrianus Jacobus Wittebrood, Velserbroek, NL;

Steven Kirkham, Ransbach-Baumbach, DE;

Achim Burger, Höhr Grenzhausen, DE;

Klaus Vieregge, Nauort, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 101/14 (2006.01); F28F 21/00 (2006.01); F28F 21/08 (2006.01); F28F 1/12 (2006.01); C22C 21/04 (2006.01); C22C 21/10 (2006.01); C22F 1/043 (2006.01); C22F 1/053 (2006.01); B23K 1/008 (2006.01); B23K 1/19 (2006.01); B23K 35/38 (2006.01); C22C 21/00 (2006.01); C22C 21/02 (2006.01); C22F 1/04 (2006.01); C22F 1/00 (2006.01); F28D 1/053 (2006.01);
U.S. Cl.
CPC ...
F28F 1/12 (2013.01); B23K 1/008 (2013.01); B23K 1/0012 (2013.01); B23K 1/19 (2013.01); B23K 35/383 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/04 (2013.01); C22C 21/10 (2013.01); C22F 1/00 (2013.01); C22F 1/04 (2013.01); C22F 1/043 (2013.01); C22F 1/053 (2013.01); F28F 21/08 (2013.01); F28F 21/084 (2013.01); F28F 21/089 (2013.01); B23K 2201/14 (2013.01); B23K 2203/10 (2013.01); F28D 1/05383 (2013.01); F28F 1/128 (2013.01); F28F 2275/04 (2013.01);
Abstract

A fin stock material from an 3xxx-series aluminum alloy and including at least 0.5% to 2.0% Mn, and furthermore a purposive addition of one or more wetting elements selected from the group of: Bi 0.03% to 0.5%, Pb 0.03% to 0.5%, Sb 0.03% to 0.5%, Li 0.03% to 0.5%, Se 0.03% to 0.5%, Y 0.03% to 0.05%, Th 0.03% to 0.05%, and the sum of these elements being 0.5% or less, with the remainder including aluminum and tolerable impurities. Also provided is a method for manufacturing a heat exchanger assembly incorporating such a fin stock material.


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