Method for etching organic film

Abstract

A method for etching an organic filmhaving a surface selectively protected by a hard mask layer, includes a partial etching process of etching the organic filmpartly in a thickness direction of the organic filmby using a mixed gas containing a gas that anisotropically etches a silicon oxide film and a gas that isotropically etches the organic film without etching the silicon oxide film; and a deposition process of depositing a protective filmmade of the silicon oxide film on side surfacesand a bottom surfaceof a recessformed in the organic film in the partial etching process. The partial etching process and the deposition process is alternately performed multiple times.