The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Apr. 16, 2008
Applicant:

Kouya Oohira, Mie, JP;

Inventor:

Kouya Oohira, Mie, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C09C 1/48 (2006.01); C08K 3/00 (2006.01); C08K 3/22 (2006.01); H01B 3/28 (2006.01); H01B 3/44 (2006.01); C08L 23/16 (2006.01);
U.S. Cl.
CPC ...
C09C 1/48 (2013.01); C08K 3/0033 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); H01B 3/28 (2013.01); H01B 3/441 (2013.01); H01B 3/442 (2013.01); C01P 2006/40 (2013.01); C08L 23/16 (2013.01);
Abstract

The present invention provides a highly dielectric elastomer molded body which is inexpensive and excellent in its dielectric property, shock resistance, flexibility, and processability and can be used at a UHF band having 800 to 960 MHz and an electronic component material for a high frequency use. The highly dielectric elastomer molded body is formed by molding a highly dielectric elastomer composition comprising an elastomer and dielectric ceramic powder added thereto. The molded body has a tensile elongation not less than 250% and a hardness not more than 70. In measurement at a frequency of 950 MHz, a dielectric constant of the highly dielectric elastomer molded body is 4 to 10, and a dielectric dissipation factor thereof is not more than 0.02. An electronic component material for a high frequency use is made of the highly dielectric elastomer molded body.


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