The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

May. 14, 2013
Applicant:

Sumitomo Wiring Systems, Ltd., Mie, JP;

Inventors:

Hirokazu Nakai, Mie, JP;

Masashi Sawada, Mie, JP;

Tomohiro Yabashi, Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 3/22 (2006.01); F16L 5/02 (2006.01); B60R 16/02 (2006.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
B60R 16/02 (2013.01); B60R 16/0222 (2013.01); H01R 13/52 (2013.01); H02G 3/22 (2013.01); Y10T 16/063 (2015.01);
Abstract

At the end portion of a wire harness that is connected through a through hole of a casing, a shielding shell is fixed to the casing and covers a connector for a harness attached to the end portion of the wire harness. A grommet covers the outside of the shielding shell. The grommet includes a main portion and a band-fastened portion, and a skirt portion extends from the band-fastened portion. A bundling band fastens the outer circumferential surface of the connecting portion via the band-fastened portion, and the skirt portion is brought into intimate contact with the outer circumferential surface of a step portion that is continuous with the connecting portion. Sealing lips that receive fastening force by the bundling band and come into intimate contact with the outer circumferential surface of the connecting portion in a squeezed state are formed on the inner circumferential surface of the band-fastened portion.


Find Patent Forward Citations

Loading…