The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
May. 26, 2015
Canon Kabushiki Kaisha, Tokyo, JP;
Yuichiro Akama, Tokyo, JP;
Kiyomitsu Kudo, Machida, JP;
Satoshi Kimura, Kawasaki, JP;
Yosuke Takagi, Yokohama, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is a liquid ejection head that makes it possible to achieve both of the stability of bonding and the shortening of a bonding time when bonding an electrical wiring substrate where thick leads applied with large current and thin leads applied with small current are mixed and a printing element substrate. For this purpose, the electrical wiring substrate includes wiring lines having different widths, and each of the wiring lines of the electric wiring substrate and a connecting terminal of the printing element substrate are connected by inner leads whose number corresponds to width of the wiring line.