The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Dec. 20, 2012
Applicants:

Jin Ki Hong, Uiwang-si, KR;

Seong Heun Cho, Uiwang-si, KR;

Kyoung Ku Kang, Uiwang-si, KR;

Hyoung Tae Im, Uiwang-si, KR;

Jung Hyo Lee, Uiwang-si, KR;

SI Kyun Park, Uiwang-si, KR;

SE Hyun Park, Uiwang-si, KR;

Inventors:

Jin Ki Hong, Uiwang-si, KR;

Seong Heun Cho, Uiwang-si, KR;

Kyoung Ku Kang, Uiwang-si, KR;

Hyoung Tae Im, Uiwang-si, KR;

Jung Hyo Lee, Uiwang-si, KR;

Si Kyun Park, Uiwang-si, KR;

Se Hyun Park, Uiwang-si, KR;

Assignee:

CHEIL INDUSTRIES, INC., Gumi-si, Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/00 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/18 (2006.01); B32B 38/06 (2006.01); B29C 35/08 (2006.01); B29C 59/04 (2006.01); B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 23/04 (2006.01); B32B 23/08 (2006.01); B32B 23/20 (2006.01); B32B 27/36 (2006.01); B32B 37/24 (2006.01); B05D 3/06 (2006.01); B05D 7/04 (2006.01); B05D 1/42 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0008 (2013.01); B29C 35/0888 (2013.01); B29C 59/046 (2013.01); B32B 7/12 (2013.01); B32B 23/04 (2013.01); B32B 23/08 (2013.01); B32B 23/20 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 38/06 (2013.01); B05D 1/42 (2013.01); B05D 3/067 (2013.01); B05D 7/04 (2013.01); B29C 2035/0827 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/243 (2013.01); B32B 2038/0076 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2310/0831 (2013.01); B32B 2333/12 (2013.01); B32B 2367/00 (2013.01); B32B 2375/00 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/31551 (2015.04);
Abstract

The present invention relates to a method for manufacturing a film laminate and to a film laminated formed by the method. The method comprises the steps of: applying a photocurable composition to a first base film; and irradiating light from a UV LED in order to harden the photocurable composition, wherein the first base film has a transmittance of approximately 50% or higher at the emission wavelength of the UV LED.


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