The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Apr. 28, 2009
Applicants:
Kai Paschkowski, Jork, DE;
Mathias Cordes, Hamburg, DE;
Inventors:
Kai Paschkowski, Jork, DE;
Mathias Cordes, Hamburg, DE;
Assignee:
SIKA TECHNOLOGY AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 151/06 (2006.01); B32B 5/02 (2006.01); B32B 5/18 (2006.01); B32B 15/08 (2006.01); B32B 21/08 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/16 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 5/02 (2013.01); B32B 5/18 (2013.01); B32B 15/08 (2013.01); B32B 21/08 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/28 (2013.01); B32B 27/285 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/327 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C09J 151/06 (2013.01); B32B 2262/06 (2013.01); B32B 2262/08 (2013.01); B32B 2270/00 (2013.01); B32B 2307/30 (2013.01); B32B 2307/308 (2013.01); B32B 2307/50 (2013.01); B32B 2405/00 (2013.01); B32B 2479/00 (2013.01); B32B 2605/00 (2013.01); B32B 2605/003 (2013.01); C09J 2201/61 (2013.01); C09J 2423/00 (2013.01); C09J 2451/00 (2013.01); Y10T 428/249921 (2015.04); Y10T 428/249985 (2015.04); Y10T 428/31663 (2015.04);
Abstract
The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-α-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between −10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.