The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Oct. 07, 2011
Yasuhiro Ookawa, Tokyo, JP;
Akiko Amano, Tokyo, JP;
Yasuhiro Ookawa, Tokyo, JP;
Akiko Amano, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
The imprint process of the invention includes at least an adhesion layer-formation step, a filling step, a curing step, and a releasing step. In the adhesion layer-formation step, an adhesive including a compound including in one molecule a tetravalent atom having one hydrolysable group and two inert group, and a reactive functional group bonded to the atom is brought into contact with a substrate blank that is then scrubbed thereby forming an adhesion layer on the substrate blank to prepare a transfer substrate. In the filling step, a mold is located in proximity to the transfer substrate with a work-material interleaved between the mold and the adhesion layer to fill the work-material up in a transfer shape area of the mold; in the curing step, the work-material is cured; and in the releasing step, the mold is released off from the work-material.