The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Jun. 18, 2012
Kenya Ito, Chiba, JP;
Koji Ohguma, Chiba, JP;
Takuro Tanaka, Chiba, JP;
Yuka Takahashi, Chiba, JP;
Aki Kuromatsu, Chiba, JP;
Mikio Yamahiro, Chiba, JP;
Kenya Ito, Chiba, JP;
Koji Ohguma, Chiba, JP;
Takuro Tanaka, Chiba, JP;
Yuka Takahashi, Chiba, JP;
Aki Kuromatsu, Chiba, JP;
Mikio Yamahiro, Chiba, JP;
JNC CORPORATION, Tokyo, JP;
Abstract
Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer () which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L). The transfer layer () comprises an IMD layer (L) laminated on the substrate (L) and to be arranged on the outermost surface of the molded body after the in-mold molding. The IMD layer (L) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.