The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

May. 27, 2012
Applicants:

Chao-chang Chen, Taipei, TW;

Chi Hsiang Hsieh, Taipei, TW;

Inventors:

Chao-Chang Chen, Taipei, TW;

Chi Hsiang Hsieh, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/00 (2006.01); B24B 37/04 (2012.01); B23H 5/08 (2006.01); H01L 21/321 (2006.01); B24B 37/20 (2012.01);
U.S. Cl.
CPC ...
B24B 37/046 (2013.01); B23H 5/08 (2013.01); B24B 37/20 (2013.01); H01L 21/32125 (2013.01);
Abstract

A novel polishing pad is described. The polishing pad includes a base plate, a main polishing body, a plurality of metal bottom portions, a positive electrode conductive wire and a negative electrode conductive wire. The main polishing body made from a non-conductive material and disposed on the base plate includes a plurality of cavities thereon. The metal bottom portions are disposed in the cavities with each of the cavities having one of the metal bottom portions therein. The positive electrode conductive wire electrically is connected to a positive electrode of a power supply. The negative electrode conductive wire electrically is connected to a negative electrode of the power supply. The positive electrode conductive wire and the negative electrode conductive wire alternatively pass through the base plate and connect to the metal bottom portions respectively.


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