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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9375782 B1

PDFFull Text
Date of Patent:
Jun. 28, 2016

Filed:

Apr. 17, 2014

Regenerating an additively manufactured component

Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

John McBrien, South Glastonbury, CT (US);

Lea Kennard Castle, Vernon, CT (US);

Brandon W. Spangler, Vernon, CT (US);

JinQuan Xu, East Greenwich, RI (US);

Assignee:

United Technologies Corporation, Hartford, CT (US);

Attorney:

Kinney & Lange, P.A.

Primary Examiner:

Kevin E Yoon

Int. Cl.
CPC ...
B22C 7/02 (2006.01); B22D 23/06 (2006.01); F01D 5/28 (2006.01); F01D 5/18 (2006.01); B22F 3/105 (2006.01); B22F 5/04 (2006.01); C30B 11/00 (2006.01); C30B 29/52 (2006.01); B22C 9/04 (2006.01); B22C 9/02 (2006.01); B22C 9/10 (2006.01); B22C 9/22 (2006.01); B23K 15/00 (2006.01); B32B 1/08 (2006.01); B32B 3/08 (2006.01); B32B 3/26 (2006.01); B32B 5/16 (2006.01); B32B 9/00 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22C 7/02 (2013.01); B22C 9/02 (2013.01); B22C 9/043 (2013.01); B22C 9/10 (2013.01); B22C 9/22 (2013.01); B22D 23/06 (2013.01); B22F 3/1055 (2013.01); B22F 5/04 (2013.01); B23K 15/0006 (2013.01); B23K 26/342 (2015.10); B32B 1/08 (2013.01); B32B 3/08 (2013.01); B32B 3/26 (2013.01); B32B 5/16 (2013.01); B32B 9/005 (2013.01); C30B 11/00 (2013.01); C30B 29/52 (2013.01); F01D 5/18 (2013.01); F01D 5/28 (2013.01); B32B 2250/03 (2013.01); B32B 2264/105 (2013.01); B32B 2603/00 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F05D 2230/31 (2013.01); Y02P 10/295 (2015.11);
Abstract

One embodiment includes a method to regenerate a component (). The method includes additively manufacturing a component () to have voids greater than 0 percent but less than approximately 15 percent in a near finished shape. The component () is encased in a shell mold (). The shell mold () is cured. The encased component () is placed in a furnace and the component () is melted. The component () is solidified in the shell mold (). The shell mold () is removed from the solidified component ().

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