The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2016

Filed:

Dec. 07, 2010
Applicants:

Peter Schwenter, Gerlafingen, CH;

Peter Perler, Port, CH;

Roger Staudenmann, Busswil b. Buren, CH;

Jörg Mayer, Niederlenz, CH;

Andrea Mueller, Winterthur, CH;

Urs Weber, Olten, CH;

Inventors:

Peter Schwenter, Gerlafingen, CH;

Peter Perler, Port, CH;

Roger Staudenmann, Busswil b. Buren, CH;

Jörg Mayer, Niederlenz, CH;

Andrea Mueller, Winterthur, CH;

Urs Weber, Olten, CH;

Assignees:

NEW DENT AG, Oensingen, CH;

WOODWELDING AG, Stansstad, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/12 (2006.01); A61C 8/00 (2006.01); A61C 13/00 (2006.01);
U.S. Cl.
CPC ...
A61C 8/0012 (2013.01); A61C 8/0016 (2013.01); A61C 13/0003 (2013.01);
Abstract

A method for producing an implant including the following steps is provided: —providing a core element having a first material; —providing a negative mold of the implant; —inserting the core element and at least one anchoring element made of a second material into the negative mold, wherein the second material is thermoplastic, —closing the negative mold and applying an elevated deformation temperature, wherein at the deformation temperature the second material is plastically deformable, viscous, or liquid and the first material is solid, —cooling the negative mold together with the core element and the anchoring element, and—removing the resulting implant from the core element and the anchoring element from the negative mold.


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