The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jun. 17, 2014
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Toru Mizuno, Tokyo, JP;

Osamu Shindo, Tokyo, JP;

Hitoshi Nakayama, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H05K 13/08 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 21/67144 (2013.01); H01L 24/81 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/81191 (2013.01); Y10T 29/49131 (2015.01); Y10T 29/49769 (2015.01); Y10T 29/53022 (2015.01); Y10T 29/53091 (2015.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01); Y10T 29/53191 (2015.01);
Abstract

A workpiece mounting apparatus includes a transfer apparatus having a nozzle, a first imaging unit, and an image processor. The nozzle has opposed first and second ends, a suction hole at the first end, and a transparent end face member sealing the second end. The first imaging unit captures a first pattern for positioning a workpiece. The image processor identifies a reference position of the workpiece based on the first pattern captured. The workpiece mounting apparatus also includes a substrate support supporting a substrate with a second pattern for positioning, a second imaging unit for capturing the second pattern, and a positioning unit for controlling position of the nozzle. The image processor identifies a mounting target position on the substrate, based on the second pattern capture, and the positioning unit controls the nozzle to mount the workpiece on the substrate, when the reference position coincides with the mounting target position.


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