The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Oct. 23, 2012
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon Gyunggi-do, KR;
Inventors:
Gyu Man Hwang, Yongin-si, KR;
Dae Hyeong Lee, Seoul, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/205 (2013.01); H05K 1/0306 (2013.01); H05K 3/0061 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10598 (2013.01); H05K 2203/063 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01);
Abstract
A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted.