The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Nov. 07, 2014
Applicant:

Furukawa Electric Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Naoki Hayamizu, Tokyo, JP;

Yuta Ishige, Tokyo, JP;

Toshio Kimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/06 (2006.01); G02B 6/42 (2006.01); H01S 5/40 (2006.01); G02B 6/32 (2006.01); H01S 5/00 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/06 (2013.01); G02B 6/4206 (2013.01); G02B 6/4214 (2013.01); H01S 5/4012 (2013.01); G02B 6/32 (2013.01); H01S 5/005 (2013.01); H01S 5/02208 (2013.01); H01S 5/02284 (2013.01);
Abstract

A semiconductor laser moduleis mainly composed of a package, a semiconductor laser, lenses, reflecting mirrors, an optical fiber, and the like. The packageis composed of a bottom part and side surfaces. The side surfacesstand erect approximately vertical to the bottom part of the package. In the semiconductor laser module, a plurality of semiconductor laser installation surfacesare formed in a step-like shape. On each semiconductor laser installation surface, a semiconductor laseris installed. A lensis arranged at the anterior (in the emission direction) of the semiconductor laser. Moreover, a lensis arranged further to the anterior. A reflecting mirroris fixed to the side surface, which is provided facing the emission direction of the semiconductor laser.


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