The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Mar. 30, 2015
Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
To suppress degradation of signals exchanged between the semiconductor chip and each of the communication modules while a large number of communication modules are mounted near a semiconductor chip at a high density. A connector includes a plug connector provided in a communication module and a receptacle connector provided in a motherboard to which the connection module is connected. The plug connector has an inserting convex portion that is connected to a module substrate included in the communication module. The receptacle connector has an inserting concave portion into which the inserting convex portion is inserted. A plurality of first connection terminals are arranged in two outer side surfaces in parallel with each other, of the inserting convex portion. A plurality of second connection terminals in contact with the first connection terminals are arranged in two inner side surfaces in parallel with each other, of the inserting concave portion. A thickness of the module substrate is one half or less of a thickness of the inserting convex portion.