The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Aug. 05, 2014
Applicant:

Wistron Corporation, New Taipei, TW;

Inventors:

Chi-Jen Kao, New Taipei, TW;

Ko-Yu Chiang, New Taipei, TW;

Yi-Kai Wang, New Taipei, TW;

Tarng-Shiang Hu, New Taipei, TW;

Assignee:

Wistron Corporation, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/10 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/107 (2013.01); H01L 51/0097 (2013.01); H01L 51/448 (2013.01); H01L 51/5253 (2013.01); Y02E 10/549 (2013.01);
Abstract

An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.


Find Patent Forward Citations

Kao, Chi-Jen. (2016). Electronic device package and manufacturing method thereof (U.S. Patent No. 9373803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9373803

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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