The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jun. 03, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Susumu Sawada, Osaka, JP;

Yoshihiro Tomita, Osaka, JP;

Koji Kawakita, Nara, JP;

Masanori Nomura, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 24/96 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/18 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An electronic part package comprises a sealing resin layer, an electronic part and a metal plating pattern layer. The sealing resin layer is provided with a principal surface including a first region that has a bellows-like shape having alternate ridges and valleys and a second region that is flat. The electronic part includes an electrode having a principal surface and is covered by the sealing resin layer except the principal surface, which is surrounded by the second region. The metal plating pattern layer is integrally provided on the first and second regions and on the principal surface of the electrode. A portion of the metal plating pattern layer, the portion located on the first region, has a bellows-like shape having alternate ridges and valleys along an outline of the first region.


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