The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

May. 15, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Mrinal K. Das, Morrisville, NC (US);

Henry Lin, Chapel Hill, NC (US);

Marcelo Schupbach, Raleigh, NC (US);

John Williams Palmour, Cary, NC (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 27/06 (2006.01); H01L 21/04 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 29/78 (2006.01); H01L 29/16 (2006.01); H05K 7/14 (2006.01); H01L 29/66 (2006.01); H01L 23/00 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H02P 7/00 (2016.01); H01L 29/739 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/046 (2013.01); H01L 21/049 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 29/1608 (2013.01); H01L 29/7802 (2013.01); H05K 7/1432 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 29/66068 (2013.01); H01L 29/7393 (2013.01); H01L 29/872 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49431 (2013.01); H01L 2224/49433 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H02P 7/0044 (2013.01); Y02B 70/1483 (2013.01);
Abstract

A power module includes a housing with an interior chamber and multiple switch modules mounted within the interior chamber of the housing. The switch modules are interconnected and configured to facilitate switching power to a load. Each one of the switch modules includes at least one transistor and at least one diode. The at least one transistor and the at least one diode may be formed from a wide band-gap material system, such as silicon carbide (SiC), thereby allowing the power module to operate at high frequencies with lower switching losses when compared to conventional power modules.


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