The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Nov. 24, 2014
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Yenting Wen, Chandler, AZ (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
In one embodiment, an electronic package structure includes a substrate having one or more conductive plane layers formed therein. The substrate also includes a plurality of conductive pads on major surface configured to provide electrical interconnects to a next level of assembly. At least one conductive plane layer is configured to have cut-outs above the solder pads so that at least portions of the solder pad are not overlapped by the conductive plane layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile