The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Aug. 08, 2012
Applicants:
Daisuke Sakurai, Osaka, JP;
Kazuya Usirokawa, Osaka, JP;
Kiyomi Hagihara, Osaka, JP;
Inventors:
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); B23K 35/24 (2006.01); B23K 35/26 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/10 (2013.01); B23K 35/001 (2013.01); B23K 35/0222 (2013.01); B23K 35/24 (2013.01); B23K 35/262 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); B23K 2201/40 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/1144 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13553 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81825 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/381 (2013.01);
Abstract
In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal () of an electronic component () and an electrode terminal () of a substrate () contains an alloy () and a metal () having a lower modulus of elasticity than the alloy (). The junction has a cross section structure in which the alloy () is surrounded by the metal () having the lower modulus of elasticity.