The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Apr. 07, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Trent S. Uehling, New Braunfels, TX (US);
Kelly F. Folts, Austin, TX (US);
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A collapsible probe tower device and methods of forming thereof, are disclosed. In one example embodiment, a method of forming a device includes providing a semiconductor die substrate having a contact pad and a probe pad, wherein the contact pad and probe pad are adhered to the substrate, forming a contact bump by applying a conductive material to a contact structure surface of a contact tower, wherein the contact tower includes the contact pad, forming a probe bump by applying a conductive material to a probe structure surface of a probe tower, wherein the probe tower includes the probe pad, and heating the conductive material that forms the contact bump and the probe bump to provide a first reflow, wherein after the first reflow, the height of a top surface of the probe bump exceeds the height of a top surface of the contact bump.