The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jul. 18, 2014
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yoshimitsu Wada, Tokyo, JP;

Nozomu Hachisuka, Tokyo, JP;

Yoshihiro Kudo, Tokyo, JP;

Jun Ono, Tokyo, JP;

Nobutaka Nishio, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/098 (2013.01); G01R 33/091 (2013.01);
Abstract

The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.


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