The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Sep. 14, 2012
Applicants:
Hiroaki Inoue, Kawasaki, JP;
Takashi Katsuki, Kawasaki, JP;
Fumihiko Nakazawa, Kawasaki, JP;
Inventors:
Assignee:
DRNC Holdings, Inc., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); G01P 15/125 (2006.01); B81C 1/00 (2006.01); G01C 19/5719 (2012.01); G01P 1/02 (2006.01); G01P 15/08 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); B81C 1/00301 (2013.01); G01C 19/5719 (2013.01); G01P 1/023 (2013.01); G01P 15/0802 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49128 (2015.01);
Abstract
A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.