The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jan. 11, 2013
Applicant:

Kistler Holding Ag, Winterthur, CH;

Inventors:

David Cornu, Bellinzona, CH;

Adrian Hofmann, Ellikon Am Rhein, CH;

Peter Frei, Pfaeffikon ZH, CH;

Assignee:

KISTLER HOLDING AG, Winterthur, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01G 19/02 (2006.01); G01G 21/28 (2006.01); G01G 3/13 (2006.01);
U.S. Cl.
CPC ...
G01G 19/024 (2013.01); G01G 3/13 (2013.01); G01G 21/28 (2013.01);
Abstract

The invention relates to a sensor package () with long design for a WIM (Weigh in Motion) sensor (), comprising a first receiving plate (), a plurality of measuring elements (), which are arranged equally spaced in a row () on the upper side () of the first receiving plate (), an electrode () covering all the measuring elements (), insulation () completely covering the electrode (), and a second receiving plate (), which covers the insulation (). In particular, each receiving plate () consists of a plurality of receiving elements () the end faces () of which are juxtaposed in a row (). According to the invention, the inner end faces () of the receiving elements () of at least one row () have profiles () which engage in a form fit manner with the profiles () of the adjacent end faces () of neighboring receiving elements (). The invention further relates to a WIM sensor () comprising a hollow profile () with a tube () and two opposing mountings () arranged therein, between which a sensor package () according to the invention is arranged under initial tension.


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