The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Mar. 19, 2013
Applicant:

Esk Ceramics Gmbh & Co. KG, Kempten, DE;

Inventors:

Martin Engler, Kempten, DE;

Krishna B. Uibel, Waltenhofen, DE;

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); B32B 9/00 (2006.01); C09C 1/00 (2006.01); C01B 21/064 (2006.01); C04B 35/583 (2006.01); C08K 3/38 (2006.01); C04B 35/581 (2006.01); C04B 35/626 (2006.01); C04B 35/63 (2006.01); C04B 35/65 (2006.01);
U.S. Cl.
CPC ...
C09C 1/00 (2013.01); C01B 21/064 (2013.01); C01B 21/0648 (2013.01); C04B 35/581 (2013.01); C04B 35/583 (2013.01); C04B 35/62675 (2013.01); C04B 35/6303 (2013.01); C04B 35/65 (2013.01); C08K 3/38 (2013.01); C01P 2004/03 (2013.01); C01P 2004/45 (2013.01); C01P 2004/61 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3409 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/386 (2013.01); C04B 2235/3813 (2013.01); C04B 2235/3865 (2013.01); C04B 2235/3869 (2013.01); C04B 2235/3873 (2013.01); C04B 2235/3886 (2013.01); C04B 2235/402 (2013.01); C04B 2235/404 (2013.01); C04B 2235/428 (2013.01); C04B 2235/46 (2013.01); C04B 2235/465 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/80 (2013.01); C08K 2003/385 (2013.01); Y10T 428/2982 (2015.01);
Abstract

The invention relates to boron nitride agglomerates, comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles are connected to one another by means of an inorganic binding phase comprising at least one nitride and/or oxynitride. The invention also relates to a method for producing such boron nitride agglomerates, wherein boron nitride starting powder in the form of boron nitride primary particles is mixed with binding-phase raw materials, processed into granules or molded bodies and these are then subjected to a temperature treatment at a temperature of at least 1000° C. in a nitriding atmosphere, and the obtained granules or molded bodies are comminuted and/or fractionated if necessary. The boron nitride agglomerates according to the invention are suitable as a filler for polymers to be used for producing polymer-boron nitride composite materials.


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