The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2016
Filed:
Aug. 13, 2015
Applicant:
Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;
Inventors:
Dong Geun Jung, Seoul, KR;
Hoon Bae Kim, Incheon, KR;
Hyo Jin Oh, Seongnam-si, KR;
Chae Min Lee, Gwacheon-si, KR;
Assignee:
Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); H01L 21/02 (2006.01); B05D 1/34 (2006.01); B05D 1/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C08J 9/0014 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/02205 (2013.01); H01L 21/02274 (2013.01); H01L 21/02318 (2013.01); B05D 1/34 (2013.01); B05D 1/62 (2013.01); C08J 2383/04 (2013.01); H01L 21/67115 (2013.01);
Abstract
The present invention relates to a plasma polymerized thin film having high hardness and a low dielectric constant and a manufacturing method thereof, and in particular, relates to a plasma polymerized thin film having high hardness and a low dielectric constant for use in semiconductor devices, which has improved mechanical strength properties such as hardness and elastic modulus while having a low dielectric constant, and a manufacturing method thereof.