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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9370884 B1

PDFFull Text
Expired
Date of Patent:
Jun. 21, 2016

Filed:

Mar. 10, 2010

Resin molding apparatus and resin molding method

Applicants:

Hideyuki Kuwahara, Kyoto, JP;

Tsutao Katayama, Kyoto, JP;

Kazuto Tanaka, Kyoto, JP;

Inventors:

Hideyuki Kuwahara, Kyoto, JP;

Tsutao Katayama, Kyoto, JP;

Kazuto Tanaka, Kyoto, JP;

Assignees:

THE DOSHISHA, Kyoto, JP;

HIDEYUKI KUWAHARA, Kyoto, JP;

Attorney:

Keating and Bennett, LLP

Primary Examiner:

Seyed Masoud Malekzadeh

Int. Cl.
CPC ...
B29C 43/52 (2006.01); B29C 33/08 (2006.01); B29C 33/06 (2006.01); H05B 3/00 (2006.01); B29C 33/00 (2006.01); B29C 35/12 (2006.01); B29C 43/36 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
B29C 43/52 (2013.01); B29C 33/08 (2013.01); B29C 33/00 (2013.01); B29C 33/0083 (2013.01); B29C 33/06 (2013.01); B29C 35/12 (2013.01); B29C 43/36 (2013.01); B29K 2105/0854 (2013.01); H05B 3/00 (2013.01);
Abstract

A resin molding apparatus includes a pair of metal molds respectively arranged so as to be insulated from the ground with insulating materials, and a molding portion including the pair of metal molds and to which a resin material is provided. At least one metal mold of the pair of metal molds is provided with electrodes at two points flanking the molding portion. A high frequency current generator capable of applying high frequency current having a frequency of about 10 kHz or more is connected to the two electrodes.

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Kuwahara, Hideyuki. (2016). Resin molding apparatus and resin molding method (U.S. Patent No. 9370884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9370884

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