The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Sep. 21, 2012
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Jochen Barnikel, Mulheim an der Ruhr, DE;

Susanne Gollerthan, Bochum, DE;

Harald Krappitz, Kirchheim unter Teck, DE;

Ingo Reinkensmeier, Frondenberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/19 (2006.01); B05D 3/02 (2006.01); B23K 35/32 (2006.01); C23C 8/64 (2006.01); C23C 8/80 (2006.01); F01D 5/28 (2006.01); B23K 35/02 (2006.01); B05D 5/00 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
B05D 3/0254 (2013.01); B05D 5/00 (2013.01); B23K 31/02 (2013.01); B23K 35/025 (2013.01); B23K 35/32 (2013.01); B23K 35/325 (2013.01); B23K 35/327 (2013.01); C23C 8/64 (2013.01); C23C 8/80 (2013.01); F01D 5/286 (2013.01); F05D 2230/236 (2013.01); F05D 2230/237 (2013.01); Y10T 156/10 (2015.01); Y10T 428/12806 (2015.01);
Abstract

A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.


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