The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Apr. 24, 2013
Applicants:

Raymond S. Addleman, Benton City, WA (US);

Wilaiwan Chouyyok, Richland, WA (US);

Xiaohong S. LI, Richland, WA (US);

Anthony D. Cinson, Richland, WA (US);

Aleksandr A. Gerasimenko, Sunderland, MA (US);

Inventors:

Raymond S. Addleman, Benton City, WA (US);

Wilaiwan Chouyyok, Richland, WA (US);

Xiaohong S. Li, Richland, WA (US);

Anthony D. Cinson, Richland, WA (US);

Aleksandr A. Gerasimenko, Sunderland, MA (US);

Assignee:

BATTELLE MEMORIAL INSTITUTE, Richland, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 69/12 (2006.01); C09D 183/04 (2006.01); C09D 127/18 (2006.01); C09D 127/22 (2006.01); B01D 67/00 (2006.01); B01D 53/22 (2006.01); C09D 177/00 (2006.01);
U.S. Cl.
CPC ...
B01D 69/12 (2013.01); B01D 53/228 (2013.01); B01D 67/0079 (2013.01); B01D 69/125 (2013.01); C09D 127/18 (2013.01); C09D 127/22 (2013.01); C09D 183/04 (2013.01); B01D 2323/00 (2013.01); B01D 2323/26 (2013.01); C09D 177/00 (2013.01); Y10T 428/249953 (2015.04);
Abstract

A method and porous multi-component material for the capture, separation or chemical reaction of a species of interest is disclosed. The porous multi-component material includes a substrate and a composite thin film. The composite thin film is formed by combining a porous polymer with a nanostructured material. The nanostructured material may include a surface chemistry for the capture of chemicals or particles. The composite thin film is coupled to the support or device surface. The method and material provides a simple, fast, and chemically and physically benign way to integrate nanostructured materials into devices while preserving their chemical activity.


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