The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Dec. 30, 2014
Industrial Technology Research Institute, Hsinchu, TW;
Tzong-Che Ho, Hsinchu, TW;
Yu-Wen Fan, Hsinchu, TW;
Hong-Ren Chen, Hsinchu, TW;
Chao-Ta Huang, Hsinchu, TW;
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Abstract
An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.