The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Feb. 10, 2011
Applicants:
Leif Steen Johansen, Brönshöj, DK;
Jan Tue Ravnkilde, Hedehusene, DK;
Inventors:
Leif Steen Johansen, Brönshöj, DK;
Jan Tue Ravnkilde, Hedehusene, DK;
Assignee:
EPCOS AG, Munich, DE;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H02N 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H02N 1/00 (2013.01); B81B 7/007 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/019 (2013.01);
Abstract
The present invention concerns a MEMS device comprising an under bump metallization ()—UBM—to contact the device via flip-chip bonding with a substrate. The UBM () is placed on the surface of the MEMS device and close to the corners of the surface. Further, the shape of the UBM () is adapted to the shape of the corners.